ECE Seminar: Advanced Packaging as the Engine of the AI Systems Era
Presenter: Tolga Acikalin, System and Package Architect, Lumilens Description: The rapid rise of artificial intelligence and machine learning—most notably recent breakthroughs in large language models—is reshaping the trajectory of the semiconductor industry and ushering in a new era of system innovation. As performance scaling at the device level slows, heterogeneous integration (HI) has emerged as […]